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EVERLIGHT ELECTRONICS CO.,LTD. Technical Data Sheet High Power LED - 0.5W EHP-A09/UY31-PU5/TR Features z z z z z z z z Feature of the device: small package with high efficiency Typical view angle: 120 ESD protection Soldering methods: SMT Grouping parameter: luminous Intensity, wavelength, forward voltage Typical optical efficiency: 27 lm/W Thermal resistance (junction to sink): 65 K/W The product itself will remain within RoHS compliant version Applications z z z z z Interior and exterior automotive lighting (e.g. turn light and indicating sign) Warning signs applied Signal and symbol luminaries Portable light source Marker lights (e.g. steps, exit ways, etc.) Materials Items Reflector Encapsulating Resin Electrodes Die attach Chip Description Heat resistant polymer Colorless clear resin Ag plating Silver paste AlGaInP Everlight Electronics Co., Ltd. Device No. : DSE-A09-005 http://www.everlight.com Prepared date: Nov. 23, 2007 Rev. 1.0 Page: 1/10 Prepared by: Terry Hsu EVERLIGHT ELECTRONICS CO.,LTD. EHP-A09/UY31-PU5/TR Dimensions N A N Package mark N C N Notes: 1. Dimensions are in millimeters. 2. Tolerances unless dimensions 0.25mm. Everlight Electronics Co., Ltd. Device No. : DSE-A09-005 http://www.everlight.com Prepared date: Nov. 23, 2007 Rev. 1.0 Page: 2/10 Prepared by: Terry Hsu EVERLIGHT ELECTRONICS CO.,LTD. EHP-A09/UY31-PU5/TR Maximum Ratings (T Ambient=25C) Parameter DC Operating Current Pulsed Forward Current ESD Sensitivity Junction Temperature Operating Temperature Storage Temperature Power Dissipation Junction To Heat-Sink Thermal Resistance Symbol IF IF ESD Tj Topr Tstg Pd Rth Rating 150 300 2000 125 -40 ~ +100 -40 ~ +100 0.5 65 Unit mA mA V C C C W K/W Electro-Optical Characteristics (TAmbient=25C) Parameter Bin B2 C1 Luminous Intensity(1) C2 D1 D2 A3 A4 Wavelength(2) A5 A6 U2 Forward Voltage(3) U3 U4 Viewing Angle(4) ---2 1/2 d Symbol Min 2240 2800 Typ. ------------------------------------120 Max 2800 3550 4500 5600 7100 587.5 590 Unit Condition Iv 3550 4500 5600 585 587.5 590 592.5 2.05 mcd IF=150mA nm 592.5 595 2.35 2.65 2.95 ---deg V VF 2.35 2.65 ---- Note. 1. Luminous Intensity measurement tolerance: 10% 2. Wavelength measurement tolerance : 1nm 3. Forward Voltage measurement tolerance: 0.1V 4. 2 1/2 is the off axis angle from lamp centerline where the luminous intensity is 1/2 of the peak value. http://www.everlight.com Prepared date: Nov. 23, 2007 Rev. 1.0 Page: 3/10 Everlight Electronics Co., Ltd. Device No. : DSE-A09-005 Prepared by: Terry Hsu EVERLIGHT ELECTRONICS CO.,LTD. EHP-A09/UY31-PU5/TR Typical Electro-Optical Characteristics Curves Relative Spectral Distribution, IF=150mA, T Ambient=25C 1.0 Forward Voltage vs Forward Current, T Ambient=25C 3.0 2.8 Relative Luminous Intensity 0.8 Forward Voltage (V) 2.6 2.4 2.2 2.0 1.8 0.6 0.4 0.2 0.0 400 500 600 700 800 0 50 100 150 200 250 300 Wavelength (nm) Forward Current (mA) Relative Luminous Intensity vs Forward Current, T Ambient=25C 1.4 Ambient Temperature & Operating Current Derating based on TJMAX = 125 250 Relative Luminous Intensity Forward Current (mA) 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0 50 100 150 200 250 300 200 150 100 50 0 20 40 60 80 100 120 140 160 Forward Current (mA) Ambient Temperature ( C) R Everlight Electronics Co., Ltd. Device No. : DSE-A09-005 http://www.everlight.com Prepared date: Nov. 23, 2007 Rev. 1.0 Page: 4/10 Prepared by: Terry Hsu EVERLIGHT ELECTRONICS CO.,LTD. EHP-A09/UY31-PU5/TR Typical Representative Spatial Radiation Pattern 1.0 Relative Luminous Intensity 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 -80 -60 -40 -20 0 20 40 60 80 Degree (2T) Everlight Electronics Co., Ltd. Device No. : DSE-A09-005 http://www.everlight.com Prepared date: Nov. 23, 2007 Rev. 1.0 Page: 5/10 Prepared by: Terry Hsu EVERLIGHT ELECTRONICS CO.,LTD. EHP-A09/UY31-PU5/TR Label explanation CPN: Customer's Production Number P/N : Production Number QTY: Packing Quantity CAT: Ranks HUE: Domain Wavelength REF: Reference LOT No: Lot Number MADE IN TAIWAN: Production Place Reel Dimensions Note: 1. Dimensions are in millimeters. 2. The tolerances unless mentioned is 0.1mm. Everlight Electronics Co., Ltd. Device No. : DSE-A09-005 http://www.everlight.com Prepared date: Nov. 23, 2007 Rev. 1.0 Page: 6/10 Prepared by: Terry Hsu EVERLIGHT ELECTRONICS CO.,LTD. EHP-A09/UY31-PU5/TR Carrier Tape Dimensions: Loaded quantity 1000 PCS per reel Package mark Note: 1. Dimensions are in millimeters. 2. The tolerances unless mentioned is 0.1mm. Moisture Resistant Packaging Label Aluminum moisture-proof bag Desiccant Label Everlight Electronics Co., Ltd. Device No. : DSE-A09-005 http://www.everlight.com Prepared date: Nov. 23, 2007 Rev. 1.0 Page: 7/10 Prepared by: Terry Hsu EVERLIGHT ELECTRONICS CO.,LTD. EHP-A09/UY31-PU5/TR Reliability Test Items Stress Test Stress Condition Stress Duration Reflow DC Operating Life High Temperature Storage High Temperature Operation Life #1 High Temperature Operation Life #2 Tsol=260C, 10sec, 6min(total) Ta=25C , IF=150mA Ta=100C Ta=55C, IF=150mA Ta=85 , IF=120mA 2 times 1000 hours 1000 hours 1000 hours 1000hours 1000 hours 1000hours 1000 hours Low Temperature Storage High Temperature/ Humidity Reverse Bias High Temperature/ Humidity Operation Life Temperature Cycle 'L H Power Temperature Cycle 'L H Thermal Shock Ta=-40C Ta=85 , RH=85% Ta=85C , RH=60%, IF=120mA H 100C 15min. ' 5min. 40C 15min. 85C 15min. ' 5min. 40C 15min. 110C 5min. 300 Cycles 1000 Cycles Pulse Test ESD Human Body Model ESD Machine Model ' 10sec. 'L 40C 5min. Ta=25 , IF=1000mA 30mS on/ 2500mS off 2000V, Interval:0.5sec 200V, Interval:0.5sec 50% 300 Cycles 30000 times 3 times 3 times *lm: Brightness attenuate difference(1000hrs) *VF: Forward voltage difference 20% Notes: All reliability items are tested under superior thermal management with 1.5 x 1.5 cm2 MCPCB. Everlight Electronics Co., Ltd. Device No. : DSE-A09-005 http://www.everlight.com Prepared date: Nov. 23, 2007 Rev. 1.0 Page: 8/10 Prepared by: Terry Hsu EVERLIGHT ELECTRONICS CO.,LTD. EHP-A09/UY31-PU5/TR Precautions For Use 1. Over-current-proof Though EHP-A09 has conducted ESD protection mechanism, customers must not use the device in reverse and should apply resistors for extra protection. Otherwise, slight voltage difference may cause enormous current shift and burn out failure would happen. 2. Storage i. ii. iii. iv. v. vi. Do not open the moisture proof bag before the devices are ready to use. Before the package is opened, LEDs should be stored at temperature less than 30 less than 90%. LEDs should be used within a year. After the package is opened, LEDs should be stored at temperature less than 30 and humidity less than 70%. LEDs should be used within 168 hours (7 days) after the package is opened. If the moisture absorbent material (silicone gel) has faded away or LEDs have exceeded the storage time, baking treatment should be implemented based on the following the conditions: pre-curing at 605 for 24 hours. and humidity 3. Thermal Management i. For maintaining the high flux output and achieving reliability, EHP-A09 series LEDs should be mounted on a metal core printed circuit board (MCPCB) or other kinds of heat sink with proper thermal connection to dissipate approximate 0.5W of thermal energy at 150mA operation. ii. Special thermal designs are also recommended to take in heat dissipation management, such as FR4 PCB on Aluminum with thermal vias or FPC on Aluminum with thermal conductive adhesive, etc. iii. Sufficient thermal management must be implemented. Otherwise, the junction temperature of dies might be over the limit at high current driving condition and LEDs' lifetime might be decreases dramatically. iv. For further thermal management suggestions, please consult Everlight Design Guide or local representatives for assistance. Everlight Electronics Co., Ltd. Device No. : DSE-A09-005 http://www.everlight.com Prepared date: Nov. 23, 2007 Rev. 1.0 Page: 9/10 Prepared by: Terry Hsu EVERLIGHT ELECTRONICS CO.,LTD. EHP-A09/UY31-PU5/TR 4. Soldering Condition 4-1. For Reflow process i. ii. EHP-A09 series are suitable for SMT process. Lead reflow soldering temperature profile iii. iv. v. Reflow soldering should not be done more than two times. In soldering process, stress on the LEDs during heating should be avoided. After soldering, do not warp the circuit board. Everlight Electronics Co., Ltd. Device No. : DSE-A09-005 http://www.everlight.com Prepared date: Nov. 23, 2007 Rev. 1.0 Page: 10/10 Prepared by: Terry Hsu |
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